C. A. Picard Multilayer Press Plates

The right tool matters

The precision and quality of a multi-layer circuit is, among other things, largely determined by the press tool. Therefore, selection and design of the tool is of utmost importance. It must meet the highest requirements in regards to precision of the hole distances, hole dimensions (for PinLam), parallelism, and flatness.

Press Plates with wire-cut registration holes on request. Variations to above mentioned tolerances and standard specifications possible on request. Subject to changes due to technical improvements without prior notice.

Carrier Plates, Top Plates, Bonding Plates
Steel Quality:

DIN 42
CrMo4
AISI 4140 H

DIN 50
CrV4
AISI 6150 H

RHCS 50 DIN X20
CrMo 13

Hardness:

ca. 40 HRC

ca. 40 / 50 HRC

50 ± 2 HRC

Thermal Expansion Coefficient:

12 x 10-6 / °C

11 x 10-6 / °C

Heat Conductivity:

42 W/mK

25 W/mK

Working Temperature:

≤ 400 °C

≤ 400°C / ≤ 250 °C

≤ 400 °C

Dimensions and Tolerances
Length / Width:
For large formats 2000mm:

± 0,5 mm / 0,0019"
+ 3-5 / -0 mm /+ 0,118" - 0,196" / -0"

Thickness:

± 0,2 mm /0,007"

Hole-to-hole tolerance for registration holes:

± 0,02 mm / 0,0007"

wire cut registration slots:

on request

Flatness:

0,2 - 3 mm / 0,0007" -0, depending on size and thickness

Parallelism:

For large formats 2000mm:

≤ 0,03 - 0,05 mm / 0,001" - 0,002"
≤ 0,1 mm / 0,003"

Surface finish:

Grit 80
Ra ca 1,2 - 2,50 μm

Available thickness:

2,0 - 15,0 mm / 0,078" - 0,590"

up to  10 mm
up to 0,393"